ASAP-1 IPS Prep System

 

Application of Diamond Milling:

    • Mill away the backside of a package to safely approach the die
    • Mill away the frontside of a package to avoid wet etch artifacts

Diamond Milling - Nanolab Technologies 

 

ASAP-1 IPS enhances the market-leading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates  thinner, polish flatter and de-process even more accurately.

ASAP-1 IPS introduces a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly.