Failure Analysis

 

Failure Analysis is the process of collecting and analyzing data to determine the cause of a failure. It is an important discipline in many branches of manufacturing where it is a vital tool used in the development of new products and for the improvement of existing products.

It relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods such as: electrical tests, microscopy, X-rays and spectroscopy.

Electrical Failure Analysis (E-FA)

    • Analytical Probe Station
    • Curve-Trace: Manual & Automated
    • Emission Microscopy: Near Infrared (EMMI)
    • Fluorescent Micro-Thermal Imaging with Lock-In (FMI)
    • Laser Stimulation Microscopy – Near Infrared
    • Scanning Optical Microscope (SOM) – Backside and Frontside
    • Time Domain Reflectometry (TDR)
    • Circuit Edit FIB (FIB-EDIT)
 

Physical Failure Analysis (P-FA)

    • 3-D X-ray Tomography
    • C-Scanning Acoustic Microscopy (C-SAM)
    • De-Capsulation
    • Deprocessing
    • FIB-SEM Cross Sectioning
    • Field Emission – Scanning Electron Microscopy (FE-SEM)
    • Mechanical Cross-Sectioning
    • Parallel Lapping
    • Real Time 2-D X-ray Imaging (RTX)
    • Scanning Acoustic Tomography (SAT)
    • Wet Chemistry – Strong Acids, Bases
 

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