Defect Analysis

 

Defect Analysis and detection has been critical to process development and control from the earliest days of integrated circuit manufacturing. For defect characterization and root cause analysis, it is time-to-answer that matters.

Defect Analysis - For Integrated Circuit Manufacturing - Nanolab 

High spatial resolution electron imaging 2D & 3D analysis of advanced process defects. FIB-SEM characterization of defects gives critical root cause analysis in the shortest time possible.

Microscopes for Defect Analysis:

    • Helios NanoLab™ DualBeam
    • Tecnai™ TEM
    • Magellan XHR SEM
 

Advanced Methods for Defect Analysis:

    • 3D Metrology
    • Circuit Edit
    • Failure Analysis
    • TEM Lamella Preparation


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News

Announced: August 25, 2015
Nanolab Technologies LEAPS Forward with High-Performance Analysis Services
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Announced: July 8, 2014
New XPS System with Argon Ion Clusters for Chemical State Depth Profiling
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