Sela MC600 – Camtek

 

Application of Cross-Sectioning/Cleaving Tool:

    • Cross-section patterned wafers to specified locations
    • Cleaving of wafers 

 

 

The SELA MC600 system gives quick and accurate cross-sections of structures, often with accuracy better than 0.2 micron. The 9 minute full process is used most, but the 3-minute quick cleave’ option is used to save time when there is less emphasis on the accuracy and more on viewing the process layers.

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