Wafer Testing

 

Wafers 

Nanolab Technologies provides a range of analytical services for wafers that are the base substrates used to develop semiconductor, optical, medical, LED and PV devices. Our experience includes depth profiling of substrates such as SOI,  epi structures and graded layers.

Nanolab provides surface sensitive techniques for front end of line (FEOL) processing, wafer cleanliness and surface evaluation – both are key to high production yields.

Wafer Testing at Nanolab Technologies 

 

Wafer Types

    • Production wafers
    • As deposited
    • Thermal annealed
    • Ion implanted
    • Plasma treated
 

Analyses Provided

    • Defect
    • Particle
    • Trace metal
    • Dopant
 

Applications

    • Surface profiles of thin film and thick coatings
    • Dopant profiling by SIMS
    • Metrology of semiconductor devices, LED’s and PV thin films
    • Coatings on glass and metal substrates
    • Quality control
 

Techniques Used

 


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News

Announced: August 25, 2015
Nanolab Technologies LEAPS Forward with High-Performance Analysis Services
Read News Release


Announced: July 8, 2014
New XPS System with Argon Ion Clusters for Chemical State Depth Profiling
Read News Release


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