Plasma FIB


Announcing:  Super-Speed Plasma FIB  (P-FIB) 

Using the super-speed provided by the plasma source, exposing multiple TSVs, large bumps and large areas of devices, is now fast and affordable

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Super-Speed Plasma FIB - Nanolab Technologies 


Super-Speed Plasma FIB 


Super-Speed Plasma FIB 


Super-Speed Plasma FIB - Nanolab Technologies Services 


Super-Speed Plasma FIB 




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The Vion™ plasma FIB is an instrument capable of highly precise high-speed cutting and milling. It has the ability to selectively mill areas of interest. In addition, the Plasma FIB can selectively deposit patterned conductors and insulators.

By combining high-speed milling with precise control, the system can be used in several ways for manufacturing of IC’s, such as:


  • Failure analysis of bumps, wire bonds, TSVs, and stacked die
  • Surgically remove package and  material to enable failure analysis and fault isolate on buried die
  • For process monitoring and development at package level
  • Defect analysis of packaged parts and MEMS devices

Failure Analysis

Semiconductor manufacturers are faced with market and competitive demands for increased device performance. Shrinking geometries and new materials often require the resolution and analysis capabilities of scanning electron microscopes (SEMs) and in some cases transmission electron microscopes (TEMs).

Failure analysis and material characterization techniques such as cross-sectioning, device modification and TEM analysis are made possible with FEI’s systems, which combine most advanced ion and electron columns and a powerful combination of defect navigation, cross-section preparation and data collection. These rich features allow support laboratories to quickly locate, expose and analyze critical defects for increased control and improved yields.


Failure analysis - Nanolab Technologies 


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