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Nanolab Instant Analyzer

Problem / Need
(Capability)
Feature
Size
Sample A
(Before, Good)
Sample B
(After, Bad)
Photo of
Tool Used
Result / Discussion
(Application)
Name of Tool
Used (Service)
             
Adhesion Failure Optical
Fiber
   SiO2 vs Silicone
Polymer
XPS
             
Amorphous Layer    TEM
             
Argon+ Ion
Cleaning
SuperAlloy
Before &
After Ion
Cleaning
  SEM, Ar+ Gun
in Auger
Auger
             
Argon+ Ion
Cleaning
Alloy
Before &
After 15
minutes of
Ion Milling
  SEM, Ar+ Gun
in Auger
Auger
             
BGA Bond Cracked   FE-SEM
             
BGA Inspection    Digital
Microscope
             
BGA Inspection    Digital
Microscope
             
Blisters on HD 2 um    SEM-EDS
             
Blister on HD 75 nm tall     AFM vs SEM
             
Bond Failure    FE-SEM
             
Bond Failure 100 x 100
um
  XPS
             
Bond Inspection Flip Chip
Stack
  8 Die Flip-Chip 2D X-ray
             
Broken Bond
Leads
1x1 mm   3D X-ray
Tomography
             
Chemical State  XPS
             
Chemistry
Uniformity
  EDS on SEM
             
Circuit Check   TDR
             
Circuit Check   TDR
             
Circuit Edit    Front-Side Circuit
Edit
CE 600
             
Complete
Unknown
2 mm   Survey Spectrum
shows PbSe
XPS
             
Construction
Analysis
   Complete
Analysis
             
Construction
Analysis
 Complete
Analysis
             
CMOS Gate Oxide   HR-TEM
             
Cracked Die ‹5 um    Good vs bad C-SAM
             
Decapsulation 10 x 10 mm    De-
Capsulation
System
             
Decapsulation    Diamond Mill
             
Defect 1 micron
diameter
   Image reveals
many unexpected
pores
FIB-SEM
             
Defect ‹1 um    Image reveals
particle induced
blockage
TEM
             
Defect Analysis ‹1 um    EF-TEM
             
Delamination ‹10 um    Optical vs C-SAM C-SAM
             
Delamination ‹20 um    Optical vs C-SAM C-SAM
             
Delamination    Optical vs X-ray C-SAM
             
Electron Beam
Induced
Discoloration
100 nA e-
beam
  Native AlOx
Overnight Under e-
Beam
Auger
             
Electron Beam
Induced
Discoloration
50 nA e-
beam
  CuO film
Overnight Under e-
Beam
Auger
             
Element Mapping    EF-TEM
             
Element Mapping    EELS
EF-TEM
             
Empirical Formula SiO2 SiO1.9  XPS
             
Energy Contrast
TEM
   Gate CD
74 eV range
EF-TEM
             
Exposure to
30% H2O2
Ag metal   SEM, Ar+ Gun
in Auger
Auger
             
FIB Cleaning 150 um    Image reveals the
need to clean after
strong milling
Plasma FIB
             
Flip Chip
Inspection
             
Flip Chip Structure  SOM
             
Gate Analysis   TEM
             
Gate Oxide ‹1 um    EDS on STEM
             
Gate Oxide Array ‹1 um    EDS on STEM
             
Gate Oxide
Defect
   TEM
             
Gate Oxide
Defect
   90 eV range EF-TEM
             
Graphite Sheets ‹1 um   Graphite and
Graphene are
related. This shows
the difference in
stacking.
FIB-SEM
             
Ge /B concentration gradient ‹10nm    Process development 3DAP - Atom Probe Tomography
             
Grain Boundary Segregation ‹10nm    Alloy Development 3DAP - Atom Probe Tomography
             
Grease Smear   XPS
             
Inorganic Compound   Raman
             
InGaN Dopant Distribution ‹10nm    Dopan Distribution 3DAP - Atom Probe Tomography
             
Interdiffusion 1 um film   GD-OES
             
Ion Cleaning    Ar+ Ion Mill inside
an Auger
Auger
             
LED Inspection
Non-Destructive
Imaging
  2D X-ray
             
LED MQWs   Z Contrast
HAADF STEM
             
Line Profile - STEM EELS    Si, N, O STEM-EELS
             
Micro-Via Crack 1x1 mm    3D X-ray
Tomography
             
Mould Release
Agent
smear   XPS
             
Non-Destructive
Imaging
BGA   2D X-ray
             
Non-Destructive
Imaging
5x5 mm   2D X-ray
             
Non-Destructive
NIR Imaging
‹1 um   Front-Side Image
1064 nm
400X
SOM
             
Non-Destructive
NIR Imaging
~1um
resolution
  Back-Side Image
1064 nm
20X
SOM
             
Organic Structure   FT-IR
             
Particle 4 micron
diameter
 Need EDS spectrum  UHR FE-SEM-
EDS
             
PCB
Interface Joint
Crack
1x1 mm    3D X-ray
Tomography
             
Photovoltaic 2 um film    GD-OES
             
Plasma Cleaning    RIE
             
Powder Analysis 1 mm   B6Si XPS
             
Probe Tracing    Probe Tracer
             
Protective Film for
Wafers
400 um     XPS
             
Re-oxidation W film on
wafer
   1-50 hr after ion
etch in UHV
XPS
             
Resistive Defect    TEM
             
Roughness Angstrom
level
   AFM
             
Short Circuit ?     SOM
             
Short Circuit ?    SOM
             
Short Circuit Test    SOM
             
Silicone Oil
Contamination
Smear   XPS
             
SiP Structure
             
Stacking Fault   Phase contrast TEM
             
Stacking Fault in Si   HR-TEM
             
TEM Sample Prep
Examples Lamella
30 um    This series shows
major steps in the
making of TEM Lamella
FIB-SEM
             
Thickness Check Total
Thickness
2000 ang
   Depth Profile XPS
             
TSV Check 50 um    Image shows Via is
nicely uniform
FIB-SEM
             
TSV Inspection    Plasma FIB
             
Water Residue XPS   XPS
             
Wedge Bond
Crack
  2D X-ray
             
Wrong Color 1 mm    XPS
             
8 nm Tall
Asperities Before
Scrubbing
   White dots are Asperities AFM