Altura 855-FEI


Applications of FIB-SEM: 

    • Using the FIB, cut the sample, then use the SEM to locate and image any defect
    • Cut a thin slice (30-50 nm), then lift it out, then image it using TEM/STEM with EDS/EELS to measure the chemistry

Altura 855 FIB-SEM - Nanolab Technologies 


The Altura 855 FIB-SEM provides the ultimate tools for defect characterization, failure analysis, and TEM sample preparation on patterned and unpatterned wafers, as well as piece parts. Advanced software automation enables automated TEM sample preparation and high throughput ion milling, all designed to increase productivity and provide rapid feedback to the manufacturing process.

To enable certain features and improve your experience with us, this site stores cookies on your computer. Please click Continue to provide your authorization and permanently remove this message.

To find out more, please see our privacy policy.