Failure Analysis is the process of collecting and analyzing data to determine the cause of a failure. It is an important discipline in many branches of manufacturing where it is a vital tool used in the development of new products and for the improvement of existing products.
It relies on collecting failed components for subsequent examination of the cause or causes of failure using a wide array of methods such as: electrical tests, microscopy, X-rays and spectroscopy.
Electrical Failure Analysis (E-FA)
- Analytical Probe Station
- Curve-Trace: Manual & Automated
- Emission Microscopy: Near Infrared (EMMI)
- Fluorescent Micro-Thermal Imaging with Lock-In (FMI)
- Laser Stimulation Microscopy – Near Infrared
- Scanning Optical Microscope (SOM) – Backside and Frontside
- Time Domain Reflectometry (TDR)
- Circuit Edit FIB (FIB-EDIT)
Physical Failure Analysis (P-FA)
- 3-D X-ray Tomography
- C-Scanning Acoustic Microscopy (C-SAM)
- De-Capsulation
- Deprocessing
- FIB-SEM Cross Sectioning
- Field Emission – Scanning Electron Microscopy (FE-SEM)
- Mechanical Cross-Sectioning
- Parallel Lapping
- Real Time 2-D X-ray Imaging (RTX)
- Scanning Acoustic Tomography (SAT)
- Wet Chemistry – Strong Acids, Bases
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Additional Supporting Tools
- 2-D X-ray Microscopy – Real Time X-ray (RTX)
- 3-D X-ray Tomography
- Analytical Transmission Electron Microscopy (AEM)
- C-Mode Scanning Acoustical Microscopy (C-SAM)
- Electron Energy Loss Spectrometry (EELS)
- Electron Spectroscopy for Chemical Analysis (ESCA)
- Energy Dispersive X-ray Spectroscopy (EDS)
- Field Emission Scanning Electron Microscopy (FE-SEM)
- Focused Ion Beam with Scanning Electron Microscopy (FIB-SEM)
- High Resolution Optical Microscopy
- Laser Confocal Microscopy (SOM)
- Scanning Acoustical Topography (SAT)
- Scanning Transmission Electron Microscopy (STEM)
- Transmission Electron Microscopy (TEM)
- Ultra High Resolution-SEM (UHR-SEM)
- X-ray Photoelectron Spectroscopy (XPS)