Application of Diamond Milling:
- Mill away the backside of a package to safely approach the die
- Mill away the frontside of a package to avoid wet etch artifacts
ASAP-1 IPS enhances the market-leading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates thinner, polish flatter and de-process even more accurately.
ASAP-1 IPS introduces a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly.