C-SAM – SonoScan

Applications of Scanning Acoustic Microscopy (C-SAM)

    • Non-destructively image packages to check for delamination
    • Non-destructively image parts with 1 µ spatial resolution



Our C-SAM is a semi-automated factory floor instrument capable of scanning boards and samples up to 24”.  The C-SAM delivers robustness and accuracy and with very large area coverage capabilities.

C-SAM accommodates even the largest boards and permits acoustic micro imaging of components mounted on the board. During the initial scan, each component is inspected while the C-SAM learns the x-y coordinates of each. It also learns the z coordinate and, equally important, the specific internal depth to be scanned.

For a flip chip, for example, the level of interest may be the die-to-underfill interface. For a conventional IC package or a BGA, the level of interest may be the die attach. The C-SAM software can even store gating information for two or more depths of interest per component.

Because not all components will have the exact same position from board-to-board, the C-SAM intelligently detects the x, y, and z coordinates and makes minor adjustments as needed, storing a detailed and highly accurate acoustic image of each component. It can also automatically analyze each image.

For example, if it detects a void in a die attach layer, software measures the area of the void as a percentage of the whole die attach area. This makes it much easier to comply with standards such as Mil-Std-883, Method 2030, and makes it easier to determine the level of significance of any single defect.