Defect Analysis and detection has been critical to process development and control from the earliest days of integrated circuit manufacturing. For defect characterization and root cause analysis, it is time-to-answer that matters.
High spatial resolution electron imaging 2D & 3D analysis of advanced process defects. FIB-SEM characterization of defects gives critical root cause analysis in the shortest time possible.
Microscopes for Defect Analysis:
- Helios NanoLab™ DualBeam
- Tecnai™ TEM
- Magellan XHR SEM
Advanced Methods for Defect Analysis:
- 3D Metrology
- Circuit Edit
- Failure Analysis
- TEM Lamella Preparation