Application:
X-rays are used to image devices, boards and medical devices, non-destructively, with 0.5-2.0µ spatial resolution
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2D & 3D X-ray Imaging use X-rays that pass through a sample and measure the intensity of the X-rays that have passed through the sample. This provides an image, which is a gray scale density map of the sample (the more dense materials absorb more X-rays and are darker). This method of physical failure analysis allows the intact direct inspection of wires, traces, solder and other objects inside the device in a non-destructive fashion.
3D X-Ray Image of a Through-Silicon-Via (TSV)
Strengths / Advantages
- Fast (<5 minutes)
- Non-Destructive
- Spatial Resolution:0.2µ
- Locate Defects inside Unit
Check Layout As-Is - Multiple Angle Viewing
Data Produced
- X-ray Images
- Gray Scale Density Map of X-rays
- Dimensional Sizing
- Need special data-give us a call.
Global Uses
- Prototype Evaluation
Customer Returns
Reliability Rejects - Production Control
- Materials Development
- Quality Control
- Problem Solving
- Failure Analysis
- Reverse Engineering
Applications
- Internal Dimensioning
- Good versus Bad
- A versus B
- Locating Opens
- Locating Shorts
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C-mode SAM is another non-destructive imaging tool. Please review that page to learn more about C-SAM.