Application of Cross-Sectioning/Cleaving Tool:
- Cross-section patterned wafers to specified locations
- Cleaving of wafers
The SELA MC600 system gives quick and accurate cross-sections of structures, often with accuracy better than 0.2 micron. The 9 minute full process is used most, but the 3-minute quick cleave’ option is used to save time when there is less emphasis on the accuracy and more on viewing the process layers.