Services Overview

Our Unique Approach to Testing and Analytical Services

Nanolab Technologies has earned a trusted place with clients in a wide variety of industries, including: semiconductor, solar, PV, bio-medical, laser, polymer….

Larger testing laboratories may promise superior reach and global service, but we find that clients really prize the ongoing relationship with our scientists, engineers and technicians, and our continuing commitment to acquiring the latest equipment.

We’re responsive. We meet our deadlines. And, we are very careful to match the exact right analytical approach to the problem at hand.

Whether you need us to perform: Surface Chemical Analysis, Advanced Microscopy, Defect Analysis, Circuit Edit, Construction Analysis, Fault Isolation, Materials Characterization, or Process Characterization, you will receive best-in-class analysis and testing at every turn.

Free Courier Service to Pickup & Return Samples

within South Bay area around Milpitas, California (see map)

ANALYTICAL SERVICES

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MICROSCOPY & IMAGING

2-D X-ray Imaging – Real Time (RTX)

3-D X-ray Tomography

Field Emission – Scanning Electron Microscopy (FE-SEM)

Focused Ion Beam – Scanning Electron Microscopy (FIB-SEM)

High Resolution Optical Microscopy

Laser Confocal Microscopy

Scanning Transmission Electron Microscopy (STEM)

Transmission Electron Microscopy (TEM)

Ultra High Resolution SEM (UHR-SEM)

MATERIALS CHARACTERIZATION – CHEMICAL & PHYSICAL

2-D X-ray Imaging

3-D X-ray Tomography

Analytical Transmission Electron Microscopy (AEM)

Electron Energy Loss Spectrometry (EELS)

Energy Dispersive Spectroscopy (EDS, EDX)

Field Emission – Scanning Electron Microscopy (FE-SEM)

Focused Ion Beam – Scanning Electron Microscopy (FIB-SEM)

High Resolution Digital Optical Microscopy (STEM)

Secondary Ion Mass Spectroscopy (SIMS)

Ultra High Resolution Sem (UHR-SEM)

X-Ray Photoelectron Spectroscopy (XPS)

ELECTRICAL FAILURE ANALYSIS (E-FA)

Analytical Probe Station

Curve-Trace – Manual & Automated

Emission Microscopy – Near Infrared (EMMI)

Flourescent Micro-Thermal Imaging with Lock-In (FMI)

Laser Stimulation Microscopy – Near Infrared

Scanning Optical Microscope (SOM) – Backside

Time Domain Reflectometry (TDR)

PHYSICAL FAILURE ANALYSIS (P-FA)

3-D X-ray Tomography

C-Scanning Acoustic Microscopy (C-SAM)

De-Capsulation

Deprocessing

FIB-SEM Cross Selection

Field Emission – Scanning Electron Microscopy (FE-SEM)

Mechanical Cross-Sectioning

Parallel Lapping

Real Time 2-D X-ray Imaging (RTX)

Scanning Acoustic Tomography (SAT)

Wet Chemistry – Strong Acids, Bases, Oxidizers

BUNDLED SERVICES for FAILURE ANALYSIS

LEVEL I

Non-Destructive, Curve Trace, Failure Verification, External Inspection, Internal Optical Inspection, C-Scanning Acoustic, Microscopy, 2-D Real Time X-ray, De-Cap, TDR

LEVEL II

LEVEL I Plus – Fault Isolation, Advanced Electrical Testing – Non-Destructive

LEVEL III

LEVEL I & II Plus – Deprocessing, Cross Sectioning, Advanced Microscopy, Materials Characterization, 3-D X-ray Tomography

SAMPLE PREPARATION Per Request

Argon Ion Milling

De-Capsulation (De-Cap)

Diamond Milling – Backside / Frontside Sample Prep

Dimpling

Focused Ion Beam – Circuit Edit (FIB – Circuit Edit)

Plasma Cleaning

Preparation for TEM / STEM / FIB-SEM

Reactive Ion Etching (RIE)

CIRCUIT EDIT

Single Beam FIB (Back-Side and Top-Side)

Single Beam FIB (Plasma Beam)

Single Beam FIB (with Gases)

MANAGED SERVICES – NANOLAB PARTNERS

Atomic Force Microscopy (AFM)

Auger Electron Spectroscopy (AES)

Fourier Transform – Infrared Spectrometry (FT-IR)

Gas Chromatography – Mass Spectrometry (GC-MS)

Glow-Discharge – Optical Emission Spectrometry (GD-OES)

Inductively Coupled Plasma – Optical Emission Spectrometry (ICP-OES)

Inductively Coupled Plasma – Mass Spectroscopy (ICP-MS)

Laser Ablation – Inductively Coupled Plasma – Mass Spectrometry (LA-ICP-MS)

Laser De-Capping

Raman Spectroscopy

X-ray Diffraction (XRD)

X-ray Reflectometry (XRR)

Wavelength Dispersive – X-ray Flourescence (WD-XRF)