Controlled etching using acidic or basic solutions
Acids, bases, organic solvents and heat are used to remove die from packages, clean parts, expose Si on ICs, decorations for cross sections…
GLOBAL USES
- Yield Enhancement
- Dendrite Growth Debug
- Package Design Debug
- Problem Solving
- Qualification Failure
- Failure Analysis
- Reverse Engineering
APPLICATIONS
- Localizing shorts
- Localizing opens
- Measuring layout features
- Die removal from PCB
- Preparation for TDR
- Preperation for 2D/3D X-ray
or Acoustic Imaging
STRENGTHS / ADVANTAGES
- Quickly visualize die side or package opens
and shorts - Check for opens and shorts at each layer
during deprocessing - Package layout verification
- Spacing rules in package open to view
- Dendrite growths can be found
- Halos between traces are obvious
- Good unit can be a TDR reference sample
